ICP - IC PACKAGING TECHNOLOGY EXPO 2024

Related Industries Description Audience Cycle
 Packaging   Electronic Design & Components  Exhibition Featuring all Kinds of Machinery, Parts and Materials for IC Packaging
 Trade Public once a year

Next Dates
Jan. 17 - 19, 2024  > in  Tokyo (Japan - Asia - Pacific)  > Tokyo International Exhibition Center (Tokyo Big Sight)
on Jan. 2025 (?)  > in  Tokyo (Japan - Asia - Pacific)  > Tokyo International Exhibition Center (Tokyo Big Sight)
Please note ! All dates are subject to changes. Contact organizers for more information before making arrangements.

Venue
Tokyo International Exhibition Center (Tokyo Big Sight)
3-21-1 Ariake
Koto-ku
Tokyo 135-0063
Japan
 +81 (0)3 5530 1111
 +81 (0)3 5530 1222
 http://www.bigsight.jp/english
Organizers
RX Japan
18F Shinjuku - Nomura Building
1-26-2 Nishishinjuku
Shinjuku - ku
Tokyo 163-0570
Japan
 +81 (0)3 3349-8501
 +81 (0)3 3349-8599
 http://www.rxjapan.jp/en
 info@reedexpo.co.jp
RX Global Events
Gateway House
28 The Quadrant
Richmond, Surrey
TW9 1DN
UK - United Kingdom
 +44 20 8271 2134
 +44 20 8910 7823
 http://rxglobal.com
 rxinfo@reedexpo.co.uk

More information
 http://www.nepconjapan.jp/hub/en-gb/about/ic-sensor-packaging-technology-expo.html
 icp-e@reedexpo.co.jp


EventsEye
Trade Show Calendar Worldwide
https://www.eventseye.com

(Last updated: Nov. 23rd 2023)