logo for ICP - IC PACKAGING TECHNOLOGY EXPO 2018

ICP - IC PACKAGING TECHNOLOGY EXPO 2018

Description

Exhibition Featuring all Kinds of Machinery, Parts and Materials for IC Packaging

Related industries

Packaging Electronic Design & Components

Audience

Trade Public

Cycle

once a year
Date City Venue
Jan. 17 - 19, 2018 Tokyo (Japan) Tokyo International Exhibition Center (Tokyo Big Sight)
on Jan. 2019 (?) Tokyo (Japan) Tokyo International Exhibition Center (Tokyo Big Sight)
Be aware that all dates are subject to change. Please contact the organizer before making any arrangement!

Venue(s)

Venue for ICP - IC PACKAGING TECHNOLOGY EXPO: Tokyo International Exhibition Center (Tokyo Big Sight) (Tokyo)
Tokyo International Exhibition Center (Tokyo Big Sight)
3-21-1 Ariake
Koto-ku
Tokyo 135-0063
Japan
+81 (0)3 5530 1111
+81 (0)3 5530 1222
Web Site E-mail

Organizers(s)

All events from the organizer of ICP - IC PACKAGING TECHNOLOGY EXPO
Reed Exhibitions Japan Ltd.
18F Shinjuku - Nomura Building
1-26-2 Nishishinjuku
Shinjuku - ku
Tokyo 163-0570
Japan
+81 (0)3 3349-8501
+81 (0)3 3349-8599
Web Site E-mail
All events from the organizer of ICP - IC PACKAGING TECHNOLOGY EXPO
Reed Exhibitions Companies
Gateway House
28 The Quadrant
Richmond, Surrey
TW9 1DN
UK - United Kingdom
+44 20 8271 2134
+44 20 8910 7823
Web Site E-mail

Contact info for ICP - IC PACKAGING TECHNOLOGY EXPO

Official Web Site
Event's E-mail Event's E-mail for exhibitors only

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Concurrent fairs (similar dates, same city)

AUTOMOTIVE WEIGHT REDUCTION EXPO INTERNATIONAL ELECTRONIC COMPONENTS TRADE SHOW PWB EXPO - PRINTED WIRING BOARDS EXPO CAR-ELE JAPAN INTERNEPCON JAPAN ROBODEX ELECTROTEST JAPAN LIGHT-TECH EXPO SMART FACTORY EXPO (SFE) EV JAPAN NEPCON JAPAN
  

EventsEye

Trade show calendar
(Last update: April 13th 2017)