IC & SENSOR PACKAGING EXPO JAPAN - OSAKA 2026

Description

Asia’s Leading Exhibition for IC Final Manufacturing gathering Advanced Equipment, Materials and Services. Assembly Equipment, Packaging Materials / Equipment, Analysis/Simulation Software for IC Packaging...

Related industries

Electronic Design & Components Measurement, Control & Testing

Audience

Trade Public

Cycle

once a year

Date	City	Venue
May 13 - 15, 2026	Osaka (Japan)	Intex Osaka

Please note ! All dates are subject to changes. Contact organizers for more information before making arrangements.

Venue(s)

Venue for IC & SENSOR PACKAGING EXPO JAPAN - OSAKA: Intex Osaka (Osaka)

Intex Osaka
1-5-102 Nanko-Kita, Suminoe-ku
Osaka, 559-0034
Japan

+81 (0)6 6612 8800

+81 (0)6 6612 8686

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Organizers(s)

All events from the organizer of IC & SENSOR PACKAGING EXPO JAPAN - OSAKA

RX Japan
18F Shinjuku - Nomura Building
1-26-2 Nishishinjuku
Shinjuku - ku
Tokyo 163-0570
Japan

+81 (0)3 3349-8501

+81 (0)3 3349-8599

Web Site E-mail

RX Global Events
Gateway House
28 The Quadrant
Richmond, Surrey
TW9 1DN
UK - United Kingdom

+44 20 8271 2134

+44 20 8910 7823

Web Site E-mail

Contact info for IC & SENSOR PACKAGING EXPO JAPAN - OSAKA

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Concurrent fairs (similar dates, same city)

ELECTROTEST JAPAN - OSAKA HIGHLY-FUNCTIONAL MATERIAL WEEK - OSAKA METAL JAPAN - HIGHLY-FUNCTIONAL METAL EXPO - OSAKA FILM EXPO - OSAKA HIGH-PERFORMANCE PLASTICS EXPO - OSAKA NEPCON JAPAN - OSAKA FINE PROCESS TECHNOLOGY EXPO JAPAN - OSAKA1 JOINING JAPAN - ADHESION & JOINING EXPO - OSAKA PHOTONIX OSAKA GREEN FACTORY EXPO JAPAN - OSAKA

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(Last update: May 26^th 2025)